The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Statistically relevant subsurface and 3D characterization

The femtosecond laser can cut many materials at rates orders of magnitude faster than a typical gallium FIB; a large (100s of micrometers) cross-section can be created within 5 minutes. As the laser has a different removal mechanism (ablation vs the ion sputtering of FIB), it can easily process challenging materials, such as non-conductive or ion-beam sensitive samples.

High-quality large volume analysis

The extremely short duration of the femtosecond laser pulses introduces almost no artifacts such as heat impact, microcracking, melting, or those typical of traditional mechanical polishing. In most cases, the laser-milled surfaces are clean enough for direct SEM imaging and even for surface-sensitive techniques such as electron backscatter diffraction (EBSD) mapping.

Built on the proven Helios 5 PFIB platform, this instrument incorporates a suite of state-of-the-art technologies to provide high-performance, high-resolution transmission electron microscopy (TEM) and atom probe tomography (APT) sample preparation and extremely high-resolution SEM imaging with precise materials contrast.

Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.