R&D-Scale Process and Material Characterization System The TriboLab CMP delivers reliable, flexible, cost-effective bench characterization of wafer polishing processes, offering on-board diagnostics and flexibility in sample type, size, and mounting for a better understanding of CMP applications. | New TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes. |
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